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Click on logos below for more information |
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Specialists in precision laser machining and drilling of difficult applications |
California (except San Diego County) |
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Over30 years of experience in multilayer ceramics:
Alumina (HTCC), Aluminum Nitride, BeO and LTCC |
Arizona, California, Oregon, Washington |
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Manufacture of custom, standard ultra precision thin film circuits, components, and related products. Contract ceramic, wafer processing services, including ion beam milling, dicing, photolithography |
Arizona, Southern California, Idaho, Oregon, Washington |
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Custom forumlated, Pre-Applied Adhesives and Sealants on ceramic, plastic lids, packages. |
Arizona, California, Idaho, Oregon, Washington | |
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Combining Plated Copper Metallization with multiplayer Thick Films for Custom Metallized Ceramic Substrates, Chip Carriers, Hermetic Packages and Submounts. Substrate materials include Alumina, Aluminum Nitride (AlN), Beryllium Oxide (BeO), Quartz, high dielectric constant materials. NEW: Direct Bond Copper - Quick-turn, low to medium volume custom Alumina, Aluminum Nitride substrates using Curamik® Master Cards |
Arizona, California |
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Custom lightweight thermal management solutions, based on a family of Spray Formed Controlled Expansion (“CE”) aluminum alloys. |
Arizona, California, Idaho, Oregon, Washington |
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Manufacturer of high reliability metal hermetic packages and windows for RF/Microwave, Fiber Optic, Detector, Power and Hybrid applications. Custom designs or choose from our thousands of standard tools. Wide range of housing materials, including Aluminum, Fe-Ni alloys including Invar® and Kovar®, and Steel. |
Arizona, Southern California, Oregon, Washington |
APA also maintains relationships with several sources of high value solutions for:
ORGANIC SUBSTRATES - click here for further details
CONTRACT MICROELECTRONIC ASSEMBLY SERVICES
Contact us today to determine the best option.
