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Contact APA
Stuart Weinshanker
Phone:
(858) 454-2149
Keyur Amin
Phone:
(714) 317-0971
Dan Codella
Phone:
(408) 674-9393
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Substrate or Package - Ceramic
Substrate or Package - Organic
Substrate or Package - Metal
Circuit, Package Design, Simulation
Thermal management materials
Component fabrication - Metal
Component fabrication - Ceramic
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